Analyses of layer-thickness effects in bilayered dental ceramics subjected to thermal stresses and ring-on-ring tests.

Chun-Hway Hsueh; G. A. Thompson; Osama M. Jadaan; Andrew A Wereszczak; Paul F Becher

doi:10.1016/j.dental.2006.12.009

Analyses of layer-thickness effects in bilayered dental ceramics subjected to thermal stresses and ring-on-ring tests.

Chun-Hway Hsueh, G. A. Thompson, Osama M. Jadaan, Andrew A Wereszczak, Paul F Becher

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Dental Materials
Volume	24
DOIs	https://doi.org/10.1016/j.dental.2006.12.009
State	Published - Jan 1 2008
Externally published	Yes

Disciplines

Materials Science and Engineering
Metallurgy

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10.1016/j.dental.2006.12.009License: Unspecified

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title = "Analyses of layer-thickness effects in bilayered dental ceramics subjected to thermal stresses and ring-on-ring tests.",

author = "Chun-Hway Hsueh and Thompson, \{G. A.\} and Jadaan, \{Osama M.\} and Wereszczak, \{Andrew A\} and Becher, \{Paul F\}",

note = "The purpose of this study was to analyze the stress distribution through the thickness of bilayered dental ceramics subjected to both thermal stresses...",

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doi = "10.1016/j.dental.2006.12.009",

language = "American English",

volume = "24",

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T1 - Analyses of layer-thickness effects in bilayered dental ceramics subjected to thermal stresses and ring-on-ring tests.

AU - Hsueh, Chun-Hway

AU - Thompson, G. A.

AU - Jadaan, Osama M.

AU - Wereszczak, Andrew A

AU - Becher, Paul F

N1 - The purpose of this study was to analyze the stress distribution through the thickness of bilayered dental ceramics subjected to both thermal stresses...

PY - 2008/1/1

Y1 - 2008/1/1

UR - https://www.sciencedirect.com/science/article/pii/S0109564107000395#!

U2 - 10.1016/j.dental.2006.12.009

DO - 10.1016/j.dental.2006.12.009

M3 - Article

SN - 1879-0097

VL - 24

JO - Dental Materials

JF - Dental Materials

ER -

Analyses of layer-thickness effects in bilayered dental ceramics subjected to thermal stresses and ring-on-ring tests.

Disciplines

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