Cantilever testing of sintered-silver interconnects

Andrew A. Wereszczak; Branndon R. Chen; Osama M. Jadaan; Brian A. Oistad; Max C. Modugno; Jeffrey W. Sharp; James R. Salvador

doi:10.1007/s10854-017-8063-3

Cantilever testing of sintered-silver interconnects

Andrew A. Wereszczak, Branndon R. Chen, Osama M. Jadaan, Brian A. Oistad, Max C. Modugno, Jeffrey W. Sharp, James R. Salvador

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Journal of Materials Science: Materials in Electronics
Volume	29
DOIs	https://doi.org/10.1007/s10854-017-8063-3
State	Published - Jan 1 2018
Externally published	Yes

Disciplines

Materials Science and Engineering

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10.1007/s10854-017-8063-3License: Unspecified

Cite this

@article{81d87eabe96b455ca92e5a06a3ccb1bb,

title = "Cantilever testing of sintered-silver interconnects",

author = "Wereszczak, {Andrew A.} and Chen, {Branndon R.} and Jadaan, {Osama M.} and Oistad, {Brian A.} and Modugno, {Max C.} and Sharp, {Jeffrey W.} and Salvador, {James R.}",

note = "Andrew A. Wereszczak Branndon R. Chen Osama M. Jadaan Brian A. Oistad Max C. Modugno Jeffrey W. Sharp James R. Salvador Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints.",

year = "2018",

month = jan,

day = "1",

doi = "10.1007/s10854-017-8063-3",

language = "American English",

volume = "29",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

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TY - JOUR

T1 - Cantilever testing of sintered-silver interconnects

AU - Wereszczak, Andrew A.

AU - Chen, Branndon R.

AU - Jadaan, Osama M.

AU - Oistad, Brian A.

AU - Modugno, Max C.

AU - Sharp, Jeffrey W.

AU - Salvador, James R.

N1 - Andrew A. Wereszczak Branndon R. Chen Osama M. Jadaan Brian A. Oistad Max C. Modugno Jeffrey W. Sharp James R. Salvador Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints.

PY - 2018/1/1

Y1 - 2018/1/1

UR - https://link.springer.com/content/pdf/10.1007%2Fs10854-017-8063-3.pdf

U2 - 10.1007/s10854-017-8063-3

DO - 10.1007/s10854-017-8063-3

M3 - Article

SN - 0957-4522

VL - 29

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

ER -

Cantilever testing of sintered-silver interconnects

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