Double-Sided Pressureless-Sintered-Silver Interconnects Fabricated by Reflow-Oven-Processing

Andrew A. Wereszczak, Branndon R. Chen, Osama M. Jadaan, Brian A. Oistad

Research output: Book/Report › Other report

Disciplines

@book{c1ce626ed5a648d79c97a360ded08b33,

title = "Double-Sided Pressureless-Sintered-Silver Interconnects Fabricated by Reflow-Oven-Processing",

author = "Wereszczak, \{Andrew A.\} and Chen, \{Branndon R.\} and Jadaan, \{Osama M.\} and Oistad, \{Brian A.\}",

year = "2018",

month = oct,

day = "1",

doi = "10.2172/1479719",

language = "American English",

}

TY - BOOK

T1 - Double-Sided Pressureless-Sintered-Silver Interconnects Fabricated by Reflow-Oven-Processing

AU - Wereszczak, Andrew A.

AU - Chen, Branndon R.

AU - Jadaan, Osama M.

AU - Oistad, Brian A.

PY - 2018/10/1

Y1 - 2018/10/1

UR - http://dx.doi.org/10.2172/1479719

U2 - 10.2172/1479719

DO - 10.2172/1479719

M3 - Other report

BT - Double-Sided Pressureless-Sintered-Silver Interconnects Fabricated by Reflow-Oven-Processing

ER -