Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†

Andrew A Wereszczak; Osama M. Jadaan; Timothy Philip Kirkland

doi:10.4071/HITEC-AWereszczak-THA11

Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†

Andrew A Wereszczak
, Osama M. Jadaan
, Timothy Philip Kirkland

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Volume	2010
DOIs	https://doi.org/10.4071/HITEC-AWereszczak-THA11
State	Published - Jan 1 2010
Externally published	Yes

Disciplines

Materials Science and Engineering
Structural Engineering

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AU - Wereszczak, Andrew A

AU - Jadaan, Osama M.

AU - Kirkland, Timothy Philip

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VL - 2010

JO - Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)

JF - Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)

ER -

Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†

Disciplines

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