Polymeric packaging for fully implantable wireless neural microsensors

Juan Aceros; Ming Yin; David A. Borton; William R. Patterson; Christopher Bull; Arto V. Nurmikko

doi:10.1109/EMBC.2012.6346038

Polymeric packaging for fully implantable wireless neural microsensors

Juan Aceros, Ming Yin, David A. Borton, William R. Patterson, Christopher Bull, Arto V. Nurmikko

Research output: Chapter or Contribution to Book › Literary contribution

Original language	English
Title of host publication	2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012
Pages	743-746
Number of pages	4
DOIs	https://doi.org/10.1109/EMBC.2012.6346038
State	Published - 2012
Externally published	Yes
Event	34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012 - San Diego, CA, United States Duration: Aug 28 2012 → Sep 1 2012

Publication series

Name	Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
ISSN (Print)	1557-170X

Conference

Conference	34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012
Country/Territory	United States
City	San Diego, CA
Period	8/28/12 → 9/1/12

ASJC Scopus Subject Areas

Signal Processing
Biomedical Engineering
Computer Vision and Pattern Recognition
Health Informatics

Access to Document

10.1109/EMBC.2012.6346038

Cite this

Aceros, J., Yin, M., Borton, D. A., Patterson, W. R., Bull, C., & Nurmikko, A. V. (2012). Polymeric packaging for fully implantable wireless neural microsensors. In 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012 (pp. 743-746). Article 6346038 (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS). https://doi.org/10.1109/EMBC.2012.6346038

Polymeric packaging for fully implantable wireless neural microsensors. / Aceros, Juan; Yin, Ming; Borton, David A. et al.
2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012. 2012. p. 743-746 6346038 (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS).

Research output: Chapter or Contribution to Book › Literary contribution

Aceros, J, Yin, M, Borton, DA, Patterson, WR, Bull, C & Nurmikko, AV 2012, Polymeric packaging for fully implantable wireless neural microsensors. in 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012., 6346038, Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, pp. 743-746, 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012, San Diego, CA, United States, 8/28/12. https://doi.org/10.1109/EMBC.2012.6346038

Aceros J, Yin M, Borton DA, Patterson WR, Bull C, Nurmikko AV. Polymeric packaging for fully implantable wireless neural microsensors. In 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012. 2012. p. 743-746. 6346038. (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS). doi: 10.1109/EMBC.2012.6346038

@inproceedings{59002fc236f54068b2aa118d36f17428,

title = "Polymeric packaging for fully implantable wireless neural microsensors",

author = "Juan Aceros and Ming Yin and Borton, \{David A.\} and Patterson, \{William R.\} and Christopher Bull and Nurmikko, \{Arto V.\}",

year = "2012",

doi = "10.1109/EMBC.2012.6346038",

language = "English",

isbn = "9781424441198",

series = "Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS",

pages = "743--746",

booktitle = "2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012",

note = "34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012 ; Conference date: 28-08-2012 Through 01-09-2012",

}

TY - GEN

T1 - Polymeric packaging for fully implantable wireless neural microsensors

AU - Aceros, Juan

AU - Yin, Ming

AU - Borton, David A.

AU - Patterson, William R.

AU - Bull, Christopher

AU - Nurmikko, Arto V.

PY - 2012

Y1 - 2012

UR - https://www.scopus.com/pages/publications/84883565339

UR - https://www.scopus.com/inward/citedby.url?scp=84883565339&partnerID=8YFLogxK

U2 - 10.1109/EMBC.2012.6346038

DO - 10.1109/EMBC.2012.6346038

M3 - Literary contribution

C2 - 23365999

AN - SCOPUS:84883565339

SN - 9781424441198

T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS

SP - 743

EP - 746

BT - 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012

T2 - 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012

Y2 - 28 August 2012 through 1 September 2012

ER -

Polymeric packaging for fully implantable wireless neural microsensors

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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