| Original language | English |
|---|---|
| Pages (from-to) | 2373-2379 |
| Number of pages | 7 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 14 |
| Issue number | 12 |
| DOIs | |
| State | Published - 2024 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
ASJC Scopus Subject Areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
Keywords
- Dynamics
- flip-chip devices
- self-alignment
- soldering
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