@article{81d87eabe96b455ca92e5a06a3ccb1bb,
title = "Cantilever testing of sintered-silver interconnects",
author = "Wereszczak, \{Andrew A.\} and Chen, \{Branndon R.\} and Jadaan, \{Osama M.\} and Oistad, \{Brian A.\} and Modugno, \{Max C.\} and Sharp, \{Jeffrey W.\} and Salvador, \{James R.\}",
note = "Andrew A. Wereszczak Branndon R. Chen Osama M. Jadaan Brian A. Oistad Max C. Modugno Jeffrey W. Sharp James R. Salvador Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints.",
year = "2018",
month = jan,
day = "1",
doi = "10.1007/s10854-017-8063-3",
language = "American English",
volume = "29",
journal = "Journal of Materials Science: Materials in Electronics",
issn = "0957-4522",
}