Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†

Andrew A Wereszczak; Osama M. Jadaan; Timothy Philip Kirkland

doi:10.4071/HITEC-AWereszczak-THA11

Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†

Andrew A Wereszczak
, Osama M. Jadaan
, Timothy Philip Kirkland

Producción científica: Article › revisión exhaustiva

Idioma original	American English
Publicación	Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Volumen	2010
DOI	https://doi.org/10.4071/HITEC-AWereszczak-THA11
Estado	Published - ene 1 2010
Publicado de forma externa	Sí

Disciplines

Materials Science and Engineering
Structural Engineering

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10.4071/HITEC-AWereszczak-THA11Licencia: Unspecified

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