The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly

Ming Kong; Yung Cheng Lee; Christopher Oshman

doi:10.1109/TCPMT.2024.3492672

The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly

Ming Kong
, Yung Cheng Lee
, Christopher Oshman

School of Engineering

Producción científica: Article › revisión exhaustiva

Idioma original	English
Páginas (desde-hasta)	2373-2379
Número de páginas	7
Publicación	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volumen	14
N.º	12
DOI	https://doi.org/10.1109/TCPMT.2024.3492672
Estado	Published - 2024

ODS de las Naciones Unidas

Este resultado contribuye a los siguientes Objetivos de Desarrollo Sostenible

Industry innovation and infrastructure

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/TCPMT.2024.3492672

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title = "The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly",

keywords = "Dynamics, flip-chip devices, self-alignment, soldering",

author = "Ming Kong and Lee, \{Yung Cheng\} and Christopher Oshman",

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AU - Kong, Ming

AU - Lee, Yung Cheng

AU - Oshman, Christopher

PY - 2024

Y1 - 2024

KW - Dynamics

KW - flip-chip devices

KW - self-alignment

KW - soldering

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

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The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly

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